Senior/Principal Signal Integrity Engineer-Silicon Photonics & AI Interconnects
San Jose, California, United States Hybrid
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About the role
Lumilens is revolutionizing AI compute infrastructure with next-generation photonic interconnects. Our solutions—leveraging co-packaged optics (CPO), near-packaged optics (NPO), high-density silicon photonics, and advanced heterogeneous integration—enable massive scale-out and scale-up architectures for the world's leading AI providers. We are seeking a world-class Senior / Principal Signal Integrity Engineer to own and drive signal integrity (SI) and closely related power delivery strategies across complex 2.5D/3D packages. These packages integrate electrical ICs, photonic ICs, chiplets, and high-bandwidth memory, where electrical interconnects must support ultra-high-speed data paths while coexisting with optical interfaces. In this high-impact role, you will lead end-to-end SI analysis and optimization for cutting-edge photonic-electronic systems, influencing architecture from concept through production.
What you'll bring
- Bachelor's or Master's degree in Electrical Engineering, Physics, or related field.
- 10+ years of relevant experience in high-speed SI/PI, with strong emphasis on board-level, package-level, and silicon-level design/validation.
- ≥56G
- Extensive hands-on experience with leading SI/PI/EM tools (e.g., Ansys HFSS 3D/Layout, SIwave, Clarity, CST, Keysight ADS Momentum/Sigrity, HSPICE, HyperLynx).
- Proven proficiency in time-domain transient simulations (HSPICE, ADS, MATLAB/Simulink) and scripting/automation (Python, TCL, MATLAB) for simulation flows, data analysis, and reporting.
- Hands-on experience with 2.5D/3D packaging technologies (silicon/organic interposers, chiplet integration, HBM stacking) and high-frequency transmission line routing in silicon/photonic contexts.
- Strong lab skills with high-bandwidth instruments (scopes, VNAs, BERTs, TDRs), measurement-simulation correlation, fixture/probing design, de-embedding, and vendor lab management.
- Track record of bringing complex high-speed hardware/optical modules from concept to production, including multiple design spins and volume manufacturing support.
- Demonstrated leadership in cross-functional design reviews, architectural influence, and clear communication of SI/PI concepts to diverse audiences.
- Deep expertise in very high-speed SerDes, including channel modeling, equalization (FFE/DFE/CTLE), jitter/crosstalk analysis, eye diagrams, BER, and compliance/margining.
- Experience with power integrity co-simulation and SSO in advanced photonic-electronic packages.
- Knowledge of emerging substrates (glass core, panel-level packaging) and optical interconnects (from pluggables to full CPO/NPO).