Full-time jobs in Boise, ID

About the role

As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing.

What you'll bring

• Bachelor’s degree in Chemical, Mechanical, Electrical, Materials Science, Physics, Chemistry, Semiconductor Engineering, or related field with 5+ years of relevant dry etch experience
• OR Master’s or PhD in a related discipline with 3+ years of relevant dry etch experience in the semiconductor industry
• Demonstrated hands‑on R&D experience advancing process performance through structured experimentation
• Proven ability to apply DOE, data analysis, and first‑principles reasoning to complex process problems
• Ability to work independently while managing multiple technical priorities and program commitments
• Deep expertise in plasma etch processes and plasma–material interactions for advanced patterning
• Experience influencing technology direction, integration strategies, or long‑term process roadmaps
• Exposure to advanced packaging technologies such as TSV, RDL, hybrid bonding, or 2.5D/3D integration
• Proficiency in statistical process control and variability reduction methodologies
• Familiarity with Python, data automation, or GenAI‑enabled analysis for process development
• As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.
• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

Benefits