Senior Process Engineer – Electroless Copper
Albuquerque, New Mexico, 87113, United States On-site
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About the role
The Senior Process Engineer – Electroless Copper is responsible for the development, optimization, qualification, and control of electroless copper deposition processes used in glass panel semiconductor manufacturing. The role focuses on achieving robust metallization performance, uniform copper deposition, excellent adhesion, defect reduction, and stable process control for advanced packaging applications. This position plays a critical role in enabling reliable seed layer formation and metallization technologies for glass substrate integration and next-generation panel-level packaging.
What you'll bring
- Engineering degree in Chemical Engineering, Materials Science, Chemistry, Metallurgy, or related field required.
- 8 – 12 years of experience in electroless copper plating, metallization processes, semiconductor wet processing, or advanced packaging technologies.
- Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently.
- Or if currently in India, will require relocation to Bhubaneswar, Odisha.
- Knowledge, Skills, and Abilities
- Strong understanding of electroless copper chemistry, surface activation, adhesion mechanisms, contamination control, and bath stability management.
- Experience with SPC, DOE, FMEA, process characterization, and analytical techniques for bath monitoring and metallization performance evaluation.
- Must be able to wear personal protective gear most of the day (where applicable).
- Prolonged periods of sitting or standing.
- Behavioral Traits
- Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
- A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.