Principal Mechanical Engineer - Antenna & Electronic Packaging
US-CA-EL SEGUNDO-R01 ~ 2000 E Imperial Hwy ~ BLDG R01 Hybrid
Salary not listedJobFig found this opening at its original source and checks that it remains available.
About the role
The Airborne Radar Design department is currently seeking a Principal Mechanical Engineer for the Radar Antenna Design II section in El Segundo, CA. The person in this position will be involved in electronics packaging design for Airborne Radar Subsystems including Antenna, Receiver, Exciter, Processor and Power Supply subsystems. Tasks will include mechanical engineering support through the hardware life cycle, including concept development, preliminary and detail design, integration and test, transition to production, production support and installation. Typical technologies include electronic enclosures, heat exchangers including coldwalls, machined components, RF microwave assemblies, wiring, connectors, and power supplies. Constraints will include size, weight, power, design to cost, design for manufacture, and compressed project schedules.
What you'll bring
- At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression.
- We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat.
- Our team solves tough, meaningful problems that create a safer, more secure world.
- The Airborne Radar Design department is currently seeking a Principal Mechanical Engineer for the Radar Antenna Design II section in El Segundo, CA.
- The person in this position will be involved in electronics packaging design for Airborne Radar Subsystems including Antenna, Receiver, Exciter, Processor and Power Supply subsystems.
- Tasks will include mechanical engineering support through the hardware life cycle, including concept development, preliminary and detail design, integration and test, transition to production, production support and installation.
- Typical technologies include electronic enclosures, heat exchangers including coldwalls, machined components, RF microwave assemblies, wiring, connectors, and power supplies.
- Constraints will include size, weight, power, design to cost, design for manufacture, and compressed project schedules.
- Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) degree or a minimum of 7 years’ prior relevant experience, to include any combination of the following:
- Experience with ANSI drawing standards.
- Experience with GD&T (Geometric Dimensioning & Tolerances).
- Experience with electronic packaging for Airborne applications.