Senior Mechanical Engineer, Electronics Packaging
Denver, COAll locationsDenver, COLong Beach, CA Hybrid
$140,000–$200,000 a yearJobFig found this opening at its original source and checks that it remains available.
About the role
True Anomaly is seeking a skilled and detail-oriented Senior Avionics Electronics Enclosure Engineer to join our Mechanical and Structures organization, fully dedicated to supporting the Avionics Components and Payloads teams. In this role, you will own the mechanical design of avionics electronics enclosures from concept through qualification — engineering housings, brackets, and structural assemblies that protect and integrate our flight electronics while relentlessly driving down mass, managing thermal performance, and surviving the rigors of launch and on-orbit operation. You bring deep expertise in precision mechanical design for space hardware, fluency in structural and thermal analysis, and a hands-on prototyping mindset that lets you iterate quickly from concept to hardware.
What you'll bring
- Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or related field
- 5+ years of professional experience in precision mechanical design for aerospace, defense, or high-reliability electronics applications
- Demonstrated expertise in electronics enclosure or chassis design, including structural, thermal, and mass optimization considerations
- Experience with structural dynamics analysis including modal, random vibration, and shock response, using FEA tools (NASTRAN, ANSYS, or equivalent)
- Experience with thermal analysis of electronics enclosures, including conductive and radiative heat transfer modeling
- Hands-on experience with 3D printing technologies for rapid prototyping and design iteration
- Excellent written and verbal communication skills
- Experience designing enclosures for space-qualified electronics, including material selection for vacuum, thermal cycling, and radiation environments
- Familiarity with topology optimization tools and additive manufacturing design principles for mass reduction
- Experience with advanced materials including aluminum alloys, titanium, carbon fiber composites, and thermal interface materials for spacecraft applications
- Familiarity with EMI/EMC shielding considerations in electronics enclosure design
- Knowledge of applicable aerospace standards (GSFC-STD-7000, MIL-STD-810, MIL-STD-461)