Packaging Mechanical Engineer
Mountain View, CA On-site
$200,000–$275,000 a yearJobFig found this opening at its original source and checks that it remains available.
About the role
Own the thermo-mechanical design of the advanced packages our AI accelerator silicon ships in. A multi-die 2.5D package is a stack of materials that all want to expand at different rates, under a lid, under load, cycling through hundreds of watts — and your job is to make it stay flat, stay bonded, and stay intact. You'll model warpage and stress through reflow and assembly, design the lid, stiffener, underfill and TIM stack that controls them, set the mechanical rules our OSATs build to, and own the socket and load mechanics where the package meets the cooling solution. You'll correlate every model against real measurement, and you'll be the person who knows whether a design will survive the assembly line before it gets there.
What you'll bring
- Exceptional abilities in thermo-mechanical analysis of semiconductor packages: warpage prediction and control, die and solder-joint stress, delamination and interfacial fracture risk, and material and structural tradeoffs
- 8+ years of packaging mechanical experience on high-performance designs, including 2.5D / 3D and multi-die packages (CoWoS, EMIB, InFO, fan-out, or equivalent) and HBM-bearing assemblies
- Hands-on with industry-standard FEA tools (Ansys Mechanical, Abaqus, or equivalent) and strong materials knowledge across underfills, mold compounds, substrates, TIMs, and lid materials
- Demonstrated ability to work closely with packaging, thermal, reliability, board, and OSAT partners to converge mechanical designs and sign them off against JEDEC and IPC standards
- Full compensation packages are based on candidate experience and relevant certifications.