Principal Wafer Bonding Integration Engineer
Santa Clara, CA Hybrid
$160,000–$220,000 a yearJobFig found this opening at its original source and checks that it remains available.
About the role
We are seeking a Wafer Bonding Integration Engineer to lead the development, integration, and manufacturing transfer of advanced wafer bonding processes that are foundational to nEye's next-generation optical switching products. This is a highly cross-functional role sitting at the intersection of product engineering, process integration, and manufacturing. You will partner closely with internal design teams and external foundry partners to develop robust wafer bonding solutions, drive new product introduction (NPI), and enable successful transition into volume manufacturing. Candidates with foundry process integration, advanced packaging, MEMS, silicon photonics, or Technical Service Engineering experience are encouraged to apply.
What you'll bring
- Fusion Bonding
- Eutectic Bonding
- Hybrid Bonding
- BS, MS, or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, MEMS, or a related technical discipline.
- 10+ years of experience in new product introduction with ownership in wafer process integration, advanced packaging, CMOS manufacturing.
- Hands-on and product development expertise with one or more advanced wafer bonding technologies, including:
- Direct Bonding
- Experience with TSV integration, wafer thinning, cavity SOI, or 3D integration technologies.
- Experience supporting products through NPI and manufacturing ramp.
- Strong understanding of wafer-level process integration and manufacturing interactions.
- Experience working directly with semiconductor foundries or external manufacturing partners.
- Strong understanding of SPC, DOE, process characterization, yield improvement, and statistical analysis.