1790 Micron Technology Taiwan Verified 27h ago
Staff HBM Design Architect
Folsom, CAAll locationsFolsom, CARichardson, TX On-site
$146,000–$297,000 a yearPay$146,000–$297,000
TypeFull-time
Work settingOn-site
Verified listing
JobFig found this opening at its original source and checks that it remains available.
About the role
In this role, you will be an HBM Design Engineer contributing to the design and analysis of digital and analog circuits for advanced HBM products. You will work closely with an experienced architecture and design team to evaluate functionality, optimize performance, and explore new memory architectures.
What you'll bring
- Bachelor’s degree in Electrical Engineering or related field
- 3+ years of relevant engineering experience
- Strong knowledge of CMOS circuit design and semiconductor device physics
- Experience with schematic entry and circuit simulation using FineSim and/or HSPICE
- Strong problem‑solving and analytical skills
- Master’s degree or higher in Electrical Engineering or related field
- Experience with advanced DRAM architectures such as 3D DRAM
- Background in high‑speed clocking, interfaces, or power delivery optimization
- Experience in mixed‑signal or custom circuit design
- Strong communication skills and ability to collaborate across design and verification teams
- The US base salary range that Micron Technology estimates it could pay for this full-time position is:
- Additional compensation may include benefits, bonuses and equity.
Benefits
Paid Holidays
Locations
Folsom, CARichardson, TX