Jobs in Richardson, TX

About the role

The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve design quality and manufacturability. You will collaborate with cross‑functional partners to support tape‑out readiness and future technology scaling. This role offers hands‑on impact across the full semiconductor design flow. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

What you'll bring

• Bachelor’s degree in Electrical Engineering or a related field, or equivalent practical experience.
• 4+ years of relevant experience with a Bachelor’s degree, or 2+ years with a Master’s degree.
• Extensive knowledge of CMOS circuit design and semiconductor device physics.
• Experience with schematic entry, Verilog, FastSPICE, and HSPICE simulations.
• Strong understanding of timing, area, power, and complexity trade‑offs in DRAM or mixed‑signal design.
• Strong verbal and written communication skills for conveying complex technical concepts.
• Self‑motivated, collaborative team player who thrives in diverse environments.
• Excellent problem‑solving and analytical skills, including scripting experience (Python, TCL, Perl).
• Prior register‑transfer level (RTL) design flow experience in DRAM or foundry processes.
• Experience with design for test (DFT) concepts or implementation at any level.
• As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.
• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

Benefits